• 680.26 Equipotential Bonding* (Summarized)
(A) Performance. The equipotential bonding required by this section shall be installed to reduce voltage
gradients in the pool area.
(B) Bonded Parts. The parts specifi ed in 680.26(B)(1) through (B)(7) shall be bonded together using solid
copper conductors, insulated covered, or bare, not smaller than 8 AWG or with rigid metal conduit of brass or
other identifi ed corrosion-resistant metal. Connections to bonded parts shall be made in accordance with 250.8. An
8 AWG or larger solid copper bonding conductor provided to reduce voltage gradients in the pool area shall not be
required to be extended or attached to remote panelboards, service equipment, or electrodes.
(1) Conductive Pool Shells. Bonding to conductive pool shells shall be provided as specifi ed in 680.26(B)(1)(a)
or (B)(1)(b). Poured concrete, pneumatically applied or sprayed concrete, and concrete block with painted or
plastered coatings shall all be considered conductive materials due to water permeability and porosity. Vinyl liners
and fi berglass composite shells shall be considered to be nonconductive materials.
(a) Structural Reinforcing Steel. Unencapsulated structural reinforcing steel shall be bonded together by steel
tie wires or the equivalent. Where structural reinforcing steel is encapsulated in a nonconductive compound,
a copper conductor grid shall be installed in accordance with 680.26(B)(1)(b).
(b) Copper Conductor Grid. A copper conductor grid shall be provided and shall comply with (b)(1)
(1) Be constructed of minimum 8 AWG bare solid copper conductors bonded to each other at all points of
crossing. The bonding shall be in accordance with 250.8 or approved means.
(2) Conform to the contour of the pool and the pool deck.
(3) Be arranged in a 300 mm (12 in.) by 300 mm (12 in.) network of conductors in a uniformly spaced
perpendicular grid pattern with a tolerance of 100 mm (4 in.).
(4) Be secured within or under the pool no more than 150 mm (6 in.) from the outer contour of the pool shell.
(2) Perimeter Surfaces. The perimeter surface shall extend for 1 m (3 ft.) horizontally beyond the inside
walls of the pool and shall include unpaved surfaces as well as poured concrete surfaces and other types
of paving. Perimeter surfaces less than 2 m (3 ft) separated by a permanent wall or building 1.5 m (5 ft) in
height or more shall require equipotential bonding on the pool side of the permanent wall or building. Bonding
to perimeter surfaces shall be provided as specifi ed in 680.26(B)(2)(a) or (2)(b) and shall be attached to the
pool reinforcing steel or copper conductor grid at a minimum of four (4) points uniformly spaced around the
perimeter of the pool. For nonconductive pool shells, bonding at four points shall not be required.
(a) Structural Reinforcing Steel. Structural reinforcing steel shall be bonded in accordance with
(b) Alternate Means. Where structural reinforcing steel is not available or is encapsulated in a nonconductive
compound, a copper conductor(s) shall be utilized where the following requirements are met:
(1) At least one minimum 8 AWG bare solid copper conductor shall be provided.
(2) The conductors shall follow the contour of the perimeter surface.
(3) Only listed splices shall be permitted.
(4) The required conductor shall be 450 to 600 mm (18 to 24 in.) from the inside walls of the pool.
(5) The required conductor shall be secured within or under the perimeter surface 100 to 150 mm
(4 in. to 6 in.) below the subgrade.
(3) Metallic Components. All metallic parts of the pool structure, including reinforcing metal not addressed
in 680.26(B)(1)(a), shall be bonded. Where reinforcing steel is encapsulated with a nonconductive compound,
the reinforcing steel shall not be required to be bonded.
(4) Underwater Lighting.
(5) Metal Fittings.
(6) Electrical Equipment.
(7) Fixed Metal Parts. All fixed metal parts shall be bonded including, but not limited to, metal-sheathed
cables and raceways, metal piping, metal awnings, metal fences, and metal door and window frames.
Exception No 1: Those separated from the pool by a permanent barrier that prevents contact by a person
shall not be required to be bonded.
Exception No 2: Those greater than 1.5 m (5 ft.) horizontally of the inside walls of the pool shall not be
required to be bonded.
Exception No 3: Those greater than 3.7 m (12 ft.) measured vertically above the maximum water level
of the pool, or as measured vertically above any observation stands, towers, or platforms, or any diving
structures, shall not be required to be bonded.
© Pool Water. An intentional bond of a minimum conductive surface area of 5600 mm2 (9 in.2) shall be
installed in contact with the pool water. This bond shall be permitted to consist of parts that are required to be
bonded in 680.26(B).
• 250.8 Connection of Grounding and Bonding Equipment**
(A) Permitted Methods. Equipment grounding conductors, grounding electrodes conductors, and bonding
jumpers shall be connected by one of the following means:
(1) Listed pressure connectors
(2) Terminal bars
(3) Pressure connectors listed as grounding and bonding equipment
(4) Exothermic welding process
(5) Machine screw-type fasteners that engage not less than two threads or are secured with a nut
(6) Thread-forming machine screws that engage not less than two threads in the enclosure
(7) Connections that are part of a listed assembly
(8) Other listed means
(B) Methods Not Permitted. Connection devices or fi ttings that depend soley on solder shall not be used.
*NEC 2011 Equipotential Bonding Article 680.26
**NEC 2011 Connection of Grounding and Bonding Equipment Article 250.8